Abstract
The technology disclosed herein provides for utilizing heat transferring members within and around vertical power delivery modules to improve transfer of heat generated in the interior of the vertical power delivery module away from the vertical power delivery module, such as towards a cold plate or heat sink. The heat transferring members can be made from a material with high thermal conductivity, such as copper, or a combination of materials that promote heat transfer. Using the heat transferring members allows for the vertical power delivery module, and any other components in a circuit package, such as printed circuit boards (PCBs), processors, etc., to operate at temperatures lower than a vertical power delivery structure without such heat transferring members. As a result, the circuit package can remain operational for a longer duration during a single session, as well as having a longer life span.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "METHOD AND APPARATUS TO REMOVE HEAT IN VERTICAL POWER MODULES", Technical Disclosure Commons, (May 25, 2025)
https://www.tdcommons.org/dpubs_series/8153