Abstract
The technology described herein relates to an integrated thermal-mechanical-electrical motherboard structure featuring exposed ground copper regions on the motherboard bottom surface directly coupled to a liquid cold plate via a thermally conductive interface material. The structural design integrates optimized conductive via arrays within power and ground traces to reduce direct current resistance and lower thermal impedance simultaneously. Keywords: Thermal management, semiconductor accelerators, motherboard architecture, cold plate assembly, ball grid array, electromigration mitigation, thermal interface material, exposed copper traces.
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Recommended Citation
N/A and , "Enhanced Motherboard Thermal Dissipation Architecture for High-Power Semiconductor Accelerator", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/12528