Abstract
A copper-filled interconnect network establishes low-resistance electrical pathways for a high-density interconnect (HDI) printed circuit board (PCB) within a machine learning accelerator. The interconnect network replaces prepreg dielectric volume with high density copper structures to support vertical power delivery and lateral power delivery. To support vertical power delivery, the architecture forms copper-filled laser trenches within the build-up layers. These laser trenches stack directly over copper-plated slots positioned in the core layers beneath the ball grid array (BGA) pads of the accelerator and the vertical power delivery module (VPM). For lateral power delivery, the interconnect network uses elongated laser trenches within the build-up layers to increase the cross-sectional copper area. The resulting structure decreases direct current resistance, lowers power loss, reduces printed circuit board (PCB) temperatures, and mitigates electro-migration.
Keywords: high-density interconnect printed circuit board (HDI PCB), ball grid array (BGA), vertical power delivery module (VPM), vertical power delivery, lateral power delivery, plated through-hole (PTH), laser microvia, copper-filled laser trench, copper-plated slot, copper-filled interconnect network, machine learning accelerator
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This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Copper-Filled and Plated Interconnect Network for High-Density Interconnect Printed Circuit Boards in Machine Learning Accelerators", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/12529