Abstract
Inline, non-destructive screening of thermal interface quality is performed on a fully assembled and sealed die–thermal-interface–cold-plate unit. A controlled electrical power stimulus is applied to one or more dies using the unit’s normal power delivery. Transient die temperature telemetry from embedded sensors and applied power from power-rail telemetry are captured without added metrology hardware. A thermal-interface quality metric is extracted, including a thermal-resistance ratio and/or transient-signature features that may be isolated using structure-function decomposition. Units are ranked relative to other units or a running baseline to support an inline go/no-go decision without requiring an absolute reject specification. The metric is recorded in manufacturing systems and may be used as a closed-loop process-control signal to adjust assembly parameters such as dispense volume, placement, or mount preload. In some embodiments, the thermal metric is fused with external inspection of liquid-metal overflow as an additional indicator.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Inline Thermal Interface Quality Assessment and Process Control Using Embedded Sensor Telemetry", Technical Disclosure Commons, (September 02, 2026)
https://www.tdcommons.org/dpubs_series/11572