Abstract

Designing the power delivery network of a system‑on‑chip (SoC) involves repeated changes to the layout and to the power grid, and engineers conventionally re‑evaluate each change with a commercial static current‑resistance (IR) drop analysis.  These analyses can run from tens of minutes to several hours across many compute workers, which lengthens each design iteration.  This disclosure describes a machine‑learning approach that estimates per‑node static IR drop for multi‑million‑node power grids from electrical and spatial features of a design database.  The approach provides two complimentary techniques: a gradient‑boosted decision‑tree regression that predicts incremental IR drop from extracted power and resistance features, and a U‑Net convolutional network that maps effective‑resistance and power‑density images to an IR‑drop heatmap.  Together, these techniques shorten iteration turnaround while reserving a full commercial analysis for final signoff.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

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