Abstract
The technology generally relates to controlling package warpage during reflow soldering using a temporary support structure. The structure, composed of a glass carrier and a high-coefficient of thermal expansion balance film, is applied to the top surface of a package substrate before the reflow process. As temperature increases during reflow, the high-coefficient of thermal expansion balance film expands or shrinks, inducing a controlled downward deformation that acts as a counter-stress. This action balances the internal stresses that cause package warpage, maintaining a flat profile throughout the reflow cycle. The flat package profile facilitates accurate alignment and bonding of its ball grid array to a printed circuit board, improving mounting yield. Following the mounting process, the temporary glass carrier and balance film are removed, leaving the package mounted in a flat state.
Keywords: package warpage, reflow soldering, glass carrier, balance film, thermal expansion, package substrate, mounting yield
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A and N/A, "Method and Apparatus for Reducing Semiconductor Package Warpage During Reflow", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/11422