Abstract
A thermal management system provides targeted cooling for densely packed, highly irregular electronic components within a sealed environment. The system utilizes a closed-loop thermal bridge incorporating an internal thermal baffle, a dedicated local fan, and a local finned heat exchanger. The internal thermal baffle forms an isolated fluid duct over components having uneven topographies, while the local fan continuously circulates air through this duct. Heat transferred to the air from the active components is subsequently dissipated through the finned heat exchanger, which interfaces directly with a facility liquid cooling loop. This configuration effectively cools complex power delivery components while maintaining a sealed, fanless external architecture. Keywords: thermal bridge, thermal baffle, local fan, heat exchanger, liquid cooling, high-voltage power delivery, sealed chassis.
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This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A and , "Hybrid Thermal Bridge System for Cooling Irregular Electronic Components in Sealed Server Chassis", Technical Disclosure Commons, (June 29, 2026)
https://www.tdcommons.org/dpubs_series/10596