Abstract
A universal footprint for co-packaged copper interconnects facilitates compatibility across diverse mating interfaces on a single substrate design. By utilizing a common physical footprint, various interconnect products can interface with the same substrate without committing to a single proprietary design. This approach allows system integrators to scale hardware deployments while maintaining flexibility in sourcing interconnect components.
Keywords: Co-packaged copper, interconnect, universal footprint, substrate design, mating interface, elastomeric interposer, compliant tail, micro-LGA socket.
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Recommended Citation
N/A, "Universal Co-Packaged Copper Interconnect Footprint", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/10008