Abstract
This publication details structural configurations for embedding components within printed circuit board cavities. As printed circuit boards are designed with increased thickness, incorporating recessed cavities allows for heterogeneous layers that accommodate components across multiple different levels. The described structures open possibilities for advanced cooling designs, improved signal integrity, reduced vertical height, and decreased material weight. For example, embedded cold plates can reside within these cavities to provide effective thermal management for components located on the opposite side of the board. Furthermore, vertical power modules or capacitors can be embedded into cavities directly opposite to an application-specific integrated circuit to shorten vias and lower power losses.
Keywords: Printed Circuit Board, PCB assembly, Cavity, Cutout, Cold Plate, Embed, Application-Specific Integrated Circuit, ASIC, Thermal Management, Signal Integrity.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "Embedded Components in Printed Circuit Board Cavities", Technical Disclosure Commons, (April 01, 2026)
https://www.tdcommons.org/dpubs_series/9688