Abstract
The present publication describes a thermal management system for protecting liquid-cooled electronic modules during transit. The system utilizes climate-controlled packaging featuring a phase change material to absorb and release heat. This approach maintains the internal temperature of the packaging within a desired range, helping to prevent liquid coolant residue from freezing during shipping. By regulating the thermal environment, the system facilitates the transportation of electronic modules containing liquid coolant, thereby streamlining logistics and deployment.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Thermal Management System for Liquid-Cooled Electronic Modules During Transit", Technical Disclosure Commons, (March 19, 2026)
https://www.tdcommons.org/dpubs_series/9575