Abstract
The present disclosure details a split-chassis hardware architecture for non-volatile data storage devices. The design physically and thermally decouples high-performance control logic from the storage media by utilizing two mechanically detachable sub-assemblies. A logic sled houses heat-generating components and signal conditioning circuitry, while a passive media vault contains the raw storage media and telemetry tracking components. The modules interface through compression connectors and a tension-latch mechanism.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Split-Chassis Architecture for Solid State Memories", Technical Disclosure Commons, (March 19, 2026)
https://www.tdcommons.org/dpubs_series/9574
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