Abstract
This disclosure describes a high‑thermal‑conductivity polymer interposer for chiplet‑based electronic packaging that uses commercially available Dyneema ultra‑high molecular weight polyethylene (UHMWPE) films embedded in a low‑temperature‑curing resin matrix to achieve in‑plane thermal conductivity of approximately 12–18 W/mK while supporting fine‑pitch redistribution layers (RDL). The structure consists of a copper base plate, a 30–50 µm Dyneema SK78 film with measured in‑plane thermal conductivity in the 20–60 W/mK range, a 25–50 µm bismaleimide triazine (BT) or epoxy‑acrylate prepreg cured below 180 °C, and 3–5 µm line/space copper RDL fabricated using standard lithography and plasma etch processes. Dyneema is used in pre‑aligned film form, eliminating the need for in‑situ fiber drawing and avoiding the thermal incompatibility between UHMWPE and high‑temperature liquid crystal polymers. A Kapitza‑corrected rule‑of‑mixtures expression is used to estimate the effective in‑plane conductivity of the Dyneema–resin composite and predicts 12–18 W/mK with realistic interfacial resistance values and volume fractions. The interposer is designed for 50 × 50 mm test coupons, scalable to full panels, and targets chiplet‑to‑chiplet links in the 10–100 GB/s range. The disclosure includes a layer stack, material selections, thermal model, and a manufacturable process flow based on lamination of Dyneema films and BT resin, followed by RDL patterning and via formation. This provides a practical, defensively published route to high‑thermal polymer interposers using existing materials and tools.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Caldwell, Michael Victor Mr., "Arachne #23: High‑Thermal Dyneema‑Based Polymer Interposer for Chiplet Integration", Technical Disclosure Commons, (February 23, 2026)
https://www.tdcommons.org/dpubs_series/9376