Abstract
Electronics for down-hole drilling operations, missile or high-power applications are exposed to harsh environments. In particular high temperatures can cause quick failure of printed-circuit board (PCB) electronic assemblies using microelectronic components (e.g. bare dies) with an organic package due to chemical degradation. Hence, typically hermetically sealed multi-chip modules (MCMs) are applied for high-temperature harsh environment applications. These modules consist of active (e.g. bare dies) and passive components assembled on various substrates in a hermetically sealed housing with pin connectors enabling external control. MCMs designed to be used for harsh environments providing a much higher reliability typically are significantly more cost intensive with higher delivery times than PCB electronics.
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Recommended Citation
"Method of electrically insulating and mechanically protecting multi-chip modules (MCM) to enable re-work capabilities", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/8870