Abstract
This disclosure presents a novel Thermal Interface Material (TIM) encapsulation method designed to enhance thermal contact between electrical or optical components and associated cooling structures such as heatsinks, test slugs, or housings for optical modules. While existing high-performance TIMs offer superior thermal conductivity, their adoption has been constrained due to fragility, particle detachment, or lack of adhesive properties, resulting in compromised reliability and performance. The disclosed solution employs partial encapsulation of the TIM between thin protective foils, such as aluminum, copper, or polymer films. This encapsulation secures the TIM, prevents shifting, contains particle debris, and provides mechanical robustness. Additionally, strategically placed cutouts or perforations in the encapsulating foil allow precise tuning of thermal resistance, enabling controlled thermal management of individual components. This technique significantly improves thermal performance, particularly in high-density configurations such as OSFP module test fixtures, while reducing complexity and cost compared to multi-slug approaches. Furthermore, the method facilitates the practical use of advanced but fragile TIMs, including graphene or carbon nanotube-based materials, thereby expanding options for effective thermal management in high-performance electronics and optics applications.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Partial Encapsulation of Thermal Interface Material to Improve Performance", Technical Disclosure Commons, (July 30, 2025)
https://www.tdcommons.org/dpubs_series/8409