Abstract
This disclosure describes techniques for direct bonding of cooling devices such as heat sinks and cold plates to silicon dies. Per techniques of this disclosure, die cooling efficiency is improved by bonding the cooling devices directly to a lower surface of the silicon die. Coolant is directly brought in touch with the die and the extended heat transfer surfaces to maximize the cooling efficiency. The direct bonding techniques utilize microstructures that include a thin layer of copper that conforms to the die surface. A cooling device such a cooling plate (cold plate) or heat sink is fabricated or obtained. Surface finishing of a lower surface of the cooling device is performed. The cooling device is directly bonded to the silicon die of the chip that is to be liquid cooled. The cooling device can include heat sinks, cooling plates, other metal cooling devices, silicon fins, and extended surfaces.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "Direct Bonding of Cooling Devices for Liquid Cooling Applications", Technical Disclosure Commons, (January 30, 2025)
https://www.tdcommons.org/dpubs_series/7786