Inventor(s)

Anonymous

Abstract

This disclosure relates to an improved conduction‐cooled enclosure for outdoor networking and electronics systems. Traditional designs often place high‐power components (e.g., switch ASICs, processors) in a “base” section and power supply units in a “lid” section, leading to significant thermal imbalances and potential chassis deformation over time. To resolve these issues, a novel approach adds a Graphite‐over‐Foam (GoF) thermal gasket along the entire mating interface between the base and lid. This gasket works alongside the existing rubber gasket for hermetic sealing and the electrically conductive gasket for EMI/EMC compliance. By providing a dedicated high‐conductivity path (on the order of 3 W/m·K to 10 W/m·K) between the hotter base and cooler lid, the GoF gasket promotes rapid and uniform heat dissipation. The resulting “4xWall conduction” dramatically reduces thermal hotspots, lowers peak temperatures, and simplifies enclosure design by fully utilizing both the base and lid fins for heat rejection. This low‐cost, easy‐to‐manufacture solution offers a fast route to thermal equilibrium in a wide range of rugged, outdoor electronic applications.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

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