Inventor(s)

Anonymous

Abstract

The present disclosure introduces a novel front-panel light emitting diode (LED) indication system that leverages an optical fiber–based approach to overcome the spatial and thermal limitations encountered in high-density telecom and networking equipment. Instead of relying on bulky light pipes mounted directly behind each transceiver port, the solution relocates the LED array to a more convenient area on the printed circuit board (PCB). Each LED is housed within a specially designed plastic socket, preventing color mixing and ensuring distinct, high-contrast indications for every port. Flexible optical fibers then guide each LED’s light from the PCB to a thin plastic strip fitted inside the front faceplate, preserving valuable faceplate real estate for heat sinks and higher port counts. By removing the constraints of conventional light pipe designs, this system maximizes available space, enhances airflow around high-power transceivers, and simplifies assembly. Additionally, the modular nature of the optical fiber harness allows for easy upgrades or replacements of individual LED modules without disturbing other board components. The result is a compact, thermally efficient, and easily serviceable means of providing robust visual status indicators in densely populated chassis environments.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

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