Abstract
The present disclosure relates heatsinks, namely a heatsink for a very high-power dissipating electrical component with an exposed die from thermal and vibration/shock perspective. The present disclosure addresses two different but co-existing challenges for the high-power components (e.g., ~500W), namely 1) Vibrational/Shock safety of Exposed/Lidless die type chip, and 2) High heat dissipation. To address these challenges, 1) a non-conductive foam gasket is added to the design to support the load over the die during the vibrations and 2) U-shaped heatpipes are added to heatsink to reduce the temperature variation throughout the heatsink. Benefits include heatsink size and weight reduction, space savings, ability to use higher power components, and safety.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Heatsink for high-power dissipating electrical components with exposed die", Technical Disclosure Commons, (June 21, 2024)
https://www.tdcommons.org/dpubs_series/7121