Abstract
This publication describes an improved flip sapphire light-emitting diode (LED) chip package. The improved LED chip package overcomes delamination, glue bleeding, insufficient glue, and other adhesion issues that are commonly found in prior LED chip packages. In the improved LED chip package, instead of using a glue stamping method to attach a phosphor layer on a flip sapphire LED, a die attach film (DAF) is utilized.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Jin, Suying, "Flip Sapphire Light-Emitting Diode (LED) Chip Package", Technical Disclosure Commons, (October 18, 2023)
https://www.tdcommons.org/dpubs_series/6328
COinS