Abstract
The technology described in this paper relates to a multi-material package stiffener ring configuration capable of modulating localized mechanical stress and thermal deformation across an integrated circuit package. By strategically incorporating materials with tailored coefficients of thermal expansion at specific locations, such as corner regions, overall z-axis displacement can be tuned and mitigated. Variations include full-thickness inserts, partial-thickness stacked material layers, multi-material package lids, and regional mold compound formulations.
Keywords: Integrated Circuit Packaging, Warpage Modulation, Multi-Material Stiffener Ring, Coefficient of Thermal Expansion, Substrate Deflection, Corner Stiffener Inserts, Semiconductor Packaging Mechanics.
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Recommended Citation
N/A and , "Multi-Material Integrated Circuit Package Stiffener Architecture", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/12346