Abstract
A direct liquid cooling system includes a metallic bond between fins and a top enclosure cover for use in high-density electronic cooling applications. Internal fin structures positioned within fluid flow channels transfer thermal energy from heat-generating components to a circulating fluid coolant. To prevent coolant from bypassing the fin structures across top clearance gaps, a copper nanoparticle sintering paste is applied between the top surfaces of the fins and the top enclosure cover. Thermal processing below the melting temperature of bulk copper forms a dense, continuous metallic interface (above mentioned metallic bond) that prevents fluid bypass, avoids thermal expansion mismatch, and eliminates capillary clogging of narrow fin channels. In another configuration, sinter paste attaches a copper foil to the fins and the copper foil is then brazed to the top cover, thus preventing fluid infiltration into fin passages.
Keywords: cold plate, direct liquid cooling, microchannel fins, copper sintering, thermal management, fluid bypass suppression, copper foil bonding, thermal dissipation.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Low-Temperature Metallic Sinter Capping for Direct Liquid Cooling Cold Plates", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/12341