Abstract
With increased power density in artificial intelligence (AI) servers, there is increased heat produced. However, the present solutions are not able to remove the heat efficiently or provide for the full capability of the processors, either in a central processing unit or a general processing unit. Presented herein is a hybrid liquid cooling system that allows modular Active Mini-tank immersion cooling (AMTIC) modules as the final stage, in conjunction with or without Direct liquid cooling loops, to facilitate server cooling.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
A Scearce, Stephen; Ho, Phong; Goergen, Joel Richard; Pillai, Hari; and Bhatia, Rakesh, "ACTIVE MINI-TANK IMMERSION COOLING", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/10412