Abstract
This disclosure presents a high-thermal-conductivity polymer interposer for chiplet-based electronic packaging, utilizing a pre-aligned Dyneema SK78 ultra-high molecular weight polyethylene (UHMWPE) film within a modified low-temperature-curing cyanate ester resin matrix. To overcome the thermal processing limitations of conventional UHMWPE, this design employs a 15% volume fraction of sub-micron boron nitride (BN) dopants and a specialized ultraviolet (UV) radical cross-linking protocol, enabling fabrication at a maximum temperature of $105^\circ\text{C}–110^\circ\text{C}$. This avoids the structural relaxation and melting threshold of the UHMWPE fibers. The resulting composite achieves an effective in-plane thermal conductivity ($K_{eff}$) of $22.4\text{ W/mK}$ and a cross-plane conductivity of $2.1\text{ W/mK}$, significantly outperforming standard passive interposers. The integration includes a plasma-grafted silane coupling interface to mitigate coefficient of thermal expansion (CTE) mismatch and prevent delamination.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Caldwell, Michael Victor Mr., "Technical Disclosure: Arachne Core Polymer Interposer (REV-2026)", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/10215