Abstract
A system and methodology for optimizing a thermocompression bonding pedestal to enhance the assembly yield of integrated circuit packages and printed circuit board assemblies. The technique involves matching the warpage of a top surface, such as a die or substrate, to a bottom surface, such as a printed circuit board or substrate. A contoured pedestal imparts a designated warpage profile to the bottom surface, which corresponds to the warpage of the top surface. The appropriate warpage profile can be determined through laboratory characterization or live characterization using a module fitted to the bonding tool. The pedestal may feature a fixed contour based on specific reflow temperatures or a dynamic contour utilizing a mechanism to adjust the shape across different temperatures. The mechanism can be but is not limited to movable blocks and actuators The bottom surface can be secured using a vacuum, and the pedestal can be heated to facilitate conformance to the desired shape.
Keywords: Thermocompression Bonding, Integrated Circuit Package, Pedestal, Substrate, Warpage, Assembly Yield, Reflow Temperature, Actuator.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Optimized Thermocompression Bonding Pedestal for Increased Assembly Yield", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/10123