Abstract
A rack-level cooling architecture for high-density network elements is disclosed. The architecture includes a modular fan rack positioned external to a primary equipment rack and supporting a plurality of field-replaceable fan modules arranged as a “wall of fans.” Each fan module is configured for blind-mate engagement from a rear side of the rack and includes a floating printed circuit board (PCB) that provides multi-axis compliance to accommodate tolerance stack-up between the fan module, fan rack, midplane, and busbar. The fan modules interface with a midplane that is mechanically coupled to a high-power rack (HPR) busbar, enabling direct electrical connection to system power from the rear of the rack. The midplane further functions as a protective barrier, restricting access to energized busbar conductors while permitting safe servicing of rear-facing components. The architecture supports horizontally distributed connection interfaces to a vertically oriented busbar, increasing connection density per rack unit. The external fan rack enables use of larger fan form factors independent of circuit pack dimensions and provides a plenum region that improves airflow uniformity, reduces turbulence, and enhances cooling efficiency. The fan rack is configured for customer-performed removal and reinstallation without specialized tools while maintaining alignment and reliable electrical and mechanical connections. The disclosed approach improves thermal performance, serviceability, and scalability for high-power rack systems while preserving rear access to network element components.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Modular Rack-Level Fan Wall with Blind-Mate Power Interface and Tolerance-Compensating Floating PCB for High-Density Systems", Technical Disclosure Commons, (April 21, 2026)
https://www.tdcommons.org/dpubs_series/9880