Abstract
This disclosure presents a hybrid thermal–structural interposer designed to address critical limitations in advanced semiconductor packaging, specifically thermal boundary layer stagnation, hotspot formation, and coefficient of thermal expansion (CTE) mismatch.
The architecture integrates an anisotropic Dyneema-based laminate for CTE tuning and in-plane thermal spreading, a targeted vortex-enhanced microfluidic manifold for boundary layer disruption, and a dual-layer pressure-balanced flow distribution system to ensure thermal uniformity across the die. Additional features include impedance-graded channel geometry, pulsed-flow operation for transient load stabilization, Kapitza-aware interface engineering to reduce interfacial thermal resistance, and a compliance buffer layer to improve long-term mechanical reliability.
Unlike conventional flat microchannel or cold-plate systems, this design applies localized vortex-induced secondary flow to actively disrupt stagnant thermal boundary layers while minimizing pressure penalties. The system is further optimized for manufacturability using low-temperature lamination processes compatible with polymer-based interposers.
All performance values presented, including a target 20–40% increase in convective heat transfer and 15–30% system-level thermal improvement, are model-predicted and intended for validation through experimental testing.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Caldwell, Michael Victor Mr., "Arachne-Chip Hybrid Interposer: Vortex-Enhanced Microfluidic, Anisotropic CTE-Tuned Thermal Platform for High-Density Chiplet Systems", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/9849