Abstract
This publication describes a co-packaged backplane system architecture that addresses insertion loss and reach limitations in high-frequency electrical channels. By incorporating a blind mate connector directly onto a chip substrate, the architecture enables direct mating to a backplane or frontplane. This approach eliminates internal flyover cables, increasing the copper reach within a system rack and reducing the complexity of the electrical channel. Keywords: co-packaged backplane, co-packaged copper, blind mate connector, insertion loss, and chip substrate.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Co-Packaged Backplane System Architecture", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/9847