Abstract
Starlift V3 is a three‑layer orbital launch architecture integrating moderate‑velocity electromagnetic launch, an extended Electromagnetic Capture Corridor (ECC), and a two‑stage orbital momentum‑exchange tether system. The design avoids exotic materials, extreme precision requirements, and single‑point megastructures. All components rely on known or near‑term technologies and can be validated through progressive subscale testing. The architecture emphasizes modularity, failure tolerance, and realistic engineering constraints. This whitepaper presents the system design, engineering specifications, operational principles, and comparison to prior art.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Caldwell, Michael Victor Mr., "STARLIFT V3: A MULTI‑LAYER ELECTROMAGNETIC–TETHER LAUNCH ARCHITECTURE", Technical Disclosure Commons, (April 16, 2026)
https://www.tdcommons.org/dpubs_series/9802