Abstract
The present disclosure relates in general to the field of equipping component carriers, such as printed circuit boards (PCBs), substrates or workpieces, with electronic components in a so-called surfacemount technology (SMT) process. Following an angled cut, a sticker is attached to the cover foil which can be gripped by a peeling mechanism.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Component Tape Preparation", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/9780
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