Abstract
This disclosure presents a hybrid thermal interposer for high-density chiplet packaging that resolves the critical failure points of modern AI hardware: thermal throttling and coefficient of thermal expansion (CTE) mismatch. The Arachne-Chip integrates an anisotropic Dyneema-based polymer spreading layer with an active, vortex-enhanced microfluidic manifold. This dual-action approach provides a passive structural lock to prevent warpage while achieving a 20–40% increase in convective heat extraction through geometric flow manipulation.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Caldwell, Michael Victor Mr., "## GCI #23-C Master Disclosure: "Arachne-Chip" Hybrid Interposer", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/9774