Abstract
The technology described in this paper relates to a technique for mitigating solder hot tear defects during rework of double-sided package assemblies on a printed circuit board. By introducing a nitrogen-rich environment to the non-reworked package on the opposite side of the board during the top-side rework process, oxidation of the solder joints can be reduced. The nitrogen rich environment improves solder surface tension and fluidity, promoting re-wetting and mitigating the separation of bulk solder from the intermetallic compound at the pad interface.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "NITROGEN REWORK FOR SOLDER HOT TEAR MITIGATION", Technical Disclosure Commons, (April 01, 2026)
https://www.tdcommons.org/dpubs_series/9696