Abstract
In compact camera modules for electronic devices (e.g., a smartphone, smart watch, or wearable device), a limited surface area exists for bonding a voice coil motor (VCM) assembly to its underlying module board. To reinforce the bond, one technique can involve integrating metallic pins extending from the VCM that are inserted into apertures on the module board and secured with solder or an adhesive, creating a mechanical interlock. Another technique may use a selective metallization process, such as laser direct structuring, to create additional solderable pads on the VCM's non-conductive housing. By creating a three-dimensional interlocking structure or expanding the solderable surface area, these approaches can improve the assembly's resistance to impacts and thermal cycling.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Nieh, Chloe; Chen, Jimmy; and Chen, Weihsung, "Reinforced Bonding for Voice Coil Motor Assemblies Using Mechanical Interlocks and Selective Metallization", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/9417