Abstract
Integration of Direct Liquid Cooling with Heterogeneous Packages
Abstract
The disclosure describes a hybrid cooling architecture designed for heterogeneous die packages. In the disclosed systems, high-power dies amenable to direct cooling can be liquid-cooled, while other, relatively low-power dies, can be cooled indirectly. As described herein, a novel cold plate architecture can be used to manage flow routing between direct and indirect cooling zones. In addition, in some embodiments, a sealant can be used around the periphery of the dies that receive DLC.
Creative Commons License
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Recommended Citation
N/A, "Integration of Direct Liquid Cooling with Heterogeneous Packages", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/9206