Abstract
This paper describes thermal management solutions for electronic devices, specifically focusing on liquid cooling mechanisms integrated directly into printed circuit boards (PCBs). The configurations detailed herein address thermal challenges by embedding cooling conduits and heat exchange structures within the PCB substrate itself. Such approaches may include embedding copper tubes inside copper coins in the PCB or may include a cold plate having inlet and outlet tubes installed into a cavity within the PCB.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Embedded Liquid Cooling Architectures for Printed Circuit Boards", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/9185
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