Abstract
A typical wireless local area network (WLAN) module typically has a square or rectangular flat surface design. This poses challenges such as a longer thermal path that can lead to elevated temperature due to trapped internal heat. Also, during the thermal gel dispensing process, a flat surface may lead to improper extrusion, resulting in incomplete coverage of the target area. This can cause inadequate heat transfer and consequently, the WLAN module may fail to achieve the required thermal dissipation performance. This disclosure describes epoxy molding compound (EMC) surface design techniques. These techniques lower the molding height above front-end modules (FEMs) in WLAN modules. The surface of the module can then act as a heat sink. This \step design reduces the length of the thermal dissipation path and also increases thermal gel capacity, providing efficient heat dissipation at low cost. Such WLAN modules can be used to improve thermal performance in wearable devices such as AR/VR/XR glasses.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Lee, Jay; Wu, Bruce; and Wu, Josh, "Epoxy Molding Compound (EMC) Surface Modification for Enhanced Thermal Performance of a WLAN Module", Technical Disclosure Commons, (November 13, 2025)
https://www.tdcommons.org/dpubs_series/8863