Abstract
This document introduces a novel method for integrating heatsink mechanical supports into large ASIC (Application-Specific Integrated Circuit) designs in a way that does not obstruct vertical power delivery. Vertical power delivery is a method that feeds current directly into the underside of the ASIC through vias. Traditional heatsink support structures use drawbars peripheral to the ASIC, distant from the ASIC’s center. The location of these drawbars necessitates the use of large backing plates, but these large backing plates interfere with vertical power delivery. The technique and apparatus described in this paper reposition the forces applied by heatsink drawbars by positioning clearance holes for the drawbars in the organic substrate, closer to the ASIC’s center. This advantageously reduces the mechanical leverage on backing plates, allowing them to be lighter, smaller, and/or perforated, while preserving thermal management performance. The technique and apparatus described enables higher power density, improved routing freedom, and scalability for large ASIC packages that support high-speed interconnects such as SERDES (Serializer/Deserializer).
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Rust-Nguyen, Dylan G.; Jagarapu, VVS Narayana; Lise, Marshall J.; and Owen, David K., "ENABLING VERTICAL POWER DELIVERY IN LARGE ASICS AND/OR ASIC PACKAGES USING INNOVATIVE HEATSINK SUPPORT STRUCTURES", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/8694