Abstract
A fold-sealed inner ESD-coated BOPET bag together with a heat-sealed outer MBB bag (with no ESD coatings) is proposed to replace the current heat-sealed ESD MBB bag for packaging direct components.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Heng, Alvin Koh Soi; Yao, Michael Yi Zhao; Hongtongsook, Aekkarit; and Boh, Tsuny Ming, "ESD-Coated BOPET Bag + MBB Bag to Replace ESD MBB Bag to Reduce Cross Contamination from Package to Direct Component", Technical Disclosure Commons, (September 15, 2025)
https://www.tdcommons.org/dpubs_series/8590
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