Abstract
A cooling apparatus for a high-power processor package includes a cold plate having integrated heat pipes or heat spreaders, which are used to transport heat from difficult to cool hotspots to a more effective cooling location. The heat pipes are filled with fluid and integrated into a base of a cold plate. Each heat pipe includes an evaporating region, condensing regions, and adiabatic regions. The evaporating region of each heat pipe is positioned to be in contact with remote or peripheral hotspots on the package. The condensing regions of each heat pipe are thermally coupled to the cold plate base, often under liquid inlet areas. This arrangement transfers heat from the distributed hotspots to the liquid coolant more efficiently. The adiabatic regions connect the evaporating region to the condensing regions. Such a cooling apparatus enables a more targeted and discretized cooling approach for high-power electronics within a compact form factor.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "COOLING APPARATUS INCLUDING INTEGRATED HEAT PIPES", Technical Disclosure Commons, (September 01, 2025)
https://www.tdcommons.org/dpubs_series/8535