Abstract
Multilayer printed circuit boards (PCBs) can use vertical vias to deliver power vertically. The resistance of a vertical via can result in large voltage drops and power losses. The voltage drop is exacerbated by the practice of using a single via per ball-grid array (BGA) ball. This disclosure describes techniques to reduce electrical resistance in PCB vias used for vertical power delivery, resulting in reduced voltage drops, reduced power losses, and improved power delivery efficiency. Clusters of redundant vias are introduced under each ball-grid array ball by leveraging high density interconnect (HDI) technology. The vias can be of type micro-via or core via. The density of via clusters can be optimized based on current flow (e.g., lateral vs. vertical current flow). Vertical PCB direct-current resistance can be reduced substantially, enabling the delivery of greater amounts of power and reducing PCB temperature.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "Clustered Redundant Vias to Improve Power Delivery in Printed Circuit Boards", Technical Disclosure Commons, (July 15, 2025)
https://www.tdcommons.org/dpubs_series/8364