Abstract
This disclosure describes techniques to reduce electrical resistance in PCBs and consequently PCB power consumption. Per techniques of this disclosure, a heatsink/cold plate is integrated with an embedded electric shunt and utilized to deliver most of the lateral current in the chip package. The heatsink or cold plate is manufactured from copper or aluminum and can reduce the electrical resistance (DC resistance) significantly when compared to a standalone PCB. Multiple power rails can be supported by the integrated electric shunt. This has the effect of reducing overall resistive losses and the IR drop across the package. The overall number of layers in PCB can be significantly reduced since there is no need to compensate for lateral losses. Additionally, material costs and electrical operating costs can be reduced. Measured PCB temperatures are lower since most of the losses occur in the heatsink and not inside the PCB.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "PCB Heatsink with Integrated Electric Shunt", Technical Disclosure Commons, (July 01, 2025)
https://www.tdcommons.org/dpubs_series/8296