Abstract
The present disclosure provides a highly efficient mechanism for cooling high-power pluggable optical transceivers operating at elevated ambient temperatures. Due to technological advancements, modern coherent optical transceivers consume significantly higher power, often up to 40W, while facing stricter junction temperature limits. Conventional cooling approaches, relying on enlarged heatsinks and increased fan speeds, have limitations, notably high thermal resistance at the heatsink-to-optics interface. The disclosed solution introduces a torsional spring-based lifting mechanism enabling controlled, high-pressure contact between the transceiver and a heatsink equipped with high-conductivity thermal interface materials (TIMs). Twin U-shaped heat pipes soldered into copper bases enhance uniform heat dissipation across the heatsink fins. The innovative design eliminates sliding friction damage, permits robust TIM application, and improves reliability and cooling effectiveness. This mechanism is cost-effective, universally adaptable across heatsink technologies, and does not require additional PCB real estate or power consumption, making it highly versatile for high-density telecom platforms.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Highly Efficient Mechanism for Cooling High-Power Pluggable Optical Transceivers via Enhanced Thermal Contact at Elevated Ambient Temperatures", Technical Disclosure Commons, (June 08, 2025)
https://www.tdcommons.org/dpubs_series/8208