Abstract

The disclosed invention pertains to a sensor housing designed for instream temperature and pressure sensing with media isolation. The sensor housing features a top end and a bottom end. Further, the sensor housing defines a temperature through hole and a pressure that extend between the top end and the bottom end of the housing. The bottom end accommodates a temperature-assembly, which includes a temperature sensor housed in a cylindrical metal part bonded with thermally conductive epoxy. This ensures quick and accurate temperature measurements while maintaining electrical isolation. The sensor housing also has a threaded section for secure attachment to housing of other components (e.g., components in which temperature and pressure measurements are required), ensuring a stable and leak-proof connection. At the top end, a recess holds the pressure sensor module, which includes a diaphragm, sense die, and Transistor Outline (TO) header. An incompressible liquid between the sense die and diaphragm facilitates measuring of the pressure. The integrated design reduces space requirements and improves signal latency, making it suitable for harsh industrial environments. The sensor housing effectively measures both temperature and pressure, offering a versatile and efficient solution for various applications.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

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