Abstract
This paper is generally directed to systems, methods, and devices that facilitate direct attachment of a high density silicon or semiconductor chip to an embedded coreless printed circuit board (“PCB”). The technology disclosed provides an assembly and method for manufacturing directed to a new coreless PCB (“CPCB”) with an embedded coreless substrate, as well as systems incorporating CPCBs. The CPCB enables direct bonding of a high density silicon chip (“HDSC”) to the CPCB as the last step in the system manufacturing process. This is in contrast to the traditional manufacturing process of first bonding an HDSC (with or without an interposer) to an intermediate package substrate to first form a chip package, and only then bonding the intermediate package substrate with an attached HDSC, to a traditional PCB. End users can now minimize the shortcomings associated with utilizing an intermediate package substrate that is positioned between a top surface of the traditional PCB and the bottom surface of the HDSC, such as coefficient of thermal expansion (“CTE”) mismatch, plated through hole power bottlenecks, and signal dissipation due to impedance mismatch.
The CPCB therefore allows for a “chip last” configuration and process or a CoWoB. configuration or chip on board (“CoB”) configuration, where an end user may bond the HDSC directly to the CPCB after completion of the design and routing of the CPCB with an embedded coreless substrate. The flexibility to design and eliminate the presence of an intermediate package substrate allows the end user to bypass the challenges associated with retroactive designing of the traditional PCB to meet chip manufacturer specifications, and instead allows for the design of an overall comprehensive system and components of the system that provide for more direct lateral interconnections with the HDSC, as well as increased signal, power, and thermal dissipation of the overall system.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "HIGH DENSITY INTERCONNECT CHIP ON BOARD", Technical Disclosure Commons, (April 01, 2025)
https://www.tdcommons.org/dpubs_series/7952