Abstract
Over time, as mobile devices and smartphones are designed to be thinner (and/or shorter), their cameras become vulnerable to separation from the chassis and to breakage. Cameras can be susceptible to failure if the device is dropped, and camera components break. This disclosure describes a holder for the infra-red cut filter (IRCF) of a camera that is of superior strength and impact resistance. The IRCF holder can be made of plastic or similar material with a bottom support, buffering material, and shaped glue. The bottom of the IRCF holder is ribbed to provide greater resistance to bending deformation. Glue-filled grooves increase buffering and reduce the force of impact, preventing separation of the camera from the device.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Su, Bin and Shiun, Wu Cheng, "Support Structure and Glue Pattern for Improving Camera Module Impact Resistance", Technical Disclosure Commons, (December 05, 2024)
https://www.tdcommons.org/dpubs_series/7629