Abstract
Warpage of chip surface can negatively affect thermal performance by forcing a larger than optimal bond line thickness when matched up against a flat cold plate. The dynamic nature of the warpage of the chip surface at different operating temperatures poses a challenge. This disclosure describes a cold plate that includes a fin plate and fins that can dynamically adjust to the warpage of a chip surface. The cold plate is designed such that the warpage of the chip surface is matched by a corresponding adjustment of the geometry of the cold plate. This ensures a uniform thermal interface between the cold plate and the chip surface. The fins are segmented and/or oriented in patterns that cause the surface of the cold plate to deform in a particular manner that matches the chip surface warpage. This can improve the contact between the surfaces, thereby improving thermal performance. Additionally, this can also result in reduced pressures across the surface of the chip. Techniques of this disclosure can be utilized for liquid-cooled applications as well as for air-cooled products that include vapor chambers.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "Cold Plate Surface that Adapts to Warpage of Chip Surface", Technical Disclosure Commons, (October 16, 2024)
https://www.tdcommons.org/dpubs_series/7437