Abstract
This disclosure describes techniques for effective thermal management in multi chip packages. Per techniques of this disclosure, individual thermal assemblies are soldered or attached using other high reliability techniques to each chiplet in a multi chip package. Additional heat channeling features such as copper plunges are provided that can aid in the spreading or the rapid removal of heat from expected hot spots of the chiplets. Micro machined modular cold plates can be utilized as the heat sinks. The heat sinks (cooling structures) are designed based on the die size of the chiplets and are directly attached to these chiplets using epoxy, solder, or other techniques to create a stable and highly reliable cooling interface. Modular microchannel cold plates (MCCP) can be directly soldered to the die. The MCCP structures can be metalized to enable a full watertight manifold assembly during the surface-mount technology (SMT) process.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "Thermal Management Solution for Multi Chip Packages", Technical Disclosure Commons, (October 16, 2024)
https://www.tdcommons.org/dpubs_series/7435