Abstract
A hybrid cooling system for modular electronic systems is presented herein. The cooling system utilizes aluminum fins with coolant ducts retrofitted to the top and bottom enclosures of a chassis. During operation, the coolant can absorb heat from the electronic system environment and transfer the heat away from the electronic system.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
D Mayya, Karthik; Hyun, Jongsuk; Siaotong, Allen; Ramesh, Tushara; and Lam, Mandy, "HYBRID COOLING FOR MODULAR ELECTRONIC SYSTEMS", Technical Disclosure Commons, (October 07, 2024)
https://www.tdcommons.org/dpubs_series/7413
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