Inventor(s)

Anonymous

Abstract

The present disclosure relates to pluggable optical modules and specifically to cooling improvements without the use of conventional thermal materials such as heat sinks, thermal interface materials, or the introduction of high-conductivity parts. The present disclosure relates to pluggable optical modules in a front-to-back airflow system, e.g., pluggable modules can include SFP+, SFP28, QSFP, QSFP28, QSFP-DD, OSFP, OSFP-XD, etc. In high-temperature ambient conditions, and for relatively high-power SFP modules (e.g., ~2W), it is challenging to cool, in particular when it is in the bottom row of a stacked array of modules.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

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