Abstract
A compact compression waterblock lid is provided with an integrated inspection cutout, designed for inspecting the die surface of chips. This solution enables active water cooling during failure analysis or operational testing while applying even distribution of the required force onto the chip in the socket. One of the benefits is that, by being in a socket, the chip does not need to be soldered to the board. The microchip is thereby allowed to function under typical or stress conditions while providing direct access to observe and analyze the chip's die for defects.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Chen, Thomas; Cheng, Danny H.; and Zhang, Galor Wenyi, "COMPACT COMPRESSION WATERBLOCK LID WITH DIE INSPECTION OPENING FOR DIE FAILURE ANALYSIS", Technical Disclosure Commons, (June 17, 2024)
https://www.tdcommons.org/dpubs_series/7106