Abstract
Techniques are presented herein that support a novel chip interconnect structure, encompassing convex- and concave-shaped copper joint pillars, for connecting a chip (that follows the Optical Internetworking Forum (OIF) next generation (NG) common electrical input/output (CEI)-224 gigabit per second (G) framework) to a printed circuit board (PCB). Aspects of the presented techniques provide excellent signal integrity (SI) performance (including return loss, insertion loss, and impedance discontinuity) in support of, for example, a 102.4 terabit (T) per second switch comprising, among other things, an application-specific integrated circuit (ASIC) having 512 lanes of 224G Serializer/Deserializer (SerDes) capacity. Under further aspects of the techniques, mechanical performance and long-term reliability are significantly improved.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Zhu, Yuqing (Bryce); Ma, Wenbin; Sapozhnikov, Mike; Xu, Dewen; Gao, Mingjian; Ding, Weiying; and Tang, Xinghai (Sean), "INTERCONNECT STRUCTURE TO IMPROVE CHIP SIGNAL INTEGRITY AND MECHANICAL RELIABILITY", Technical Disclosure Commons, (August 29, 2023)
https://www.tdcommons.org/dpubs_series/6198